SEMI E157

Specification for Module Process Tracking

Wafer

SEMI E157 plays a crucial role in supporting flexible manufacturing by enabling detailed visibility into sub-process-level activities within complex tools. It enables precise tracking of the wafer state and the module status, which is critical for high throughput and minimal downtime. The standard supports both standalone and integrated equipment modules. 

SEMI E157 provides a guideline to report process related data during a recipe execution from the equipment to the fab host. 

The granularity of the reported data can reach down to each single recipe step. Process data with relevant context information have to support process module specific data parameters.

Examples for relevant context data within the process chamber that can be reported: 

  • Current recipe and recipe step
  • Recipe parameter values
  • Raw sensor data

By laying focus on critical process steps, the amount of data sent is reduced. At the same time, an effective analyses opportunity is provided, enabling process adjustments for higher product quality and throughput.

Would you like to learn more about how you can implement SEMI standards? Send us a message and we will get back to you as soon as possible.
 

Roman Olwig Senior Sales Manager Kontron AIS GmbH
Roman Olwig
Senior Sales Manager
Connectivity, Integration and Rail Automation